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Backplane
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Welcome to Leanpac
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Profile
1987 established as a connector company in Taiwan.
1990 Press-Fit backplane assembly manufacturer.
1997 subcontract manufacturer of Telecom, PC & Industrial
Connectors and alliance with Tyco & Molex.
1998 ISO 9001--2000 certified in both Taiwan and China.
2000 OEM & ODM alliance with Winchester.
2003 Member of PICMG and PXI Systems Alliance.
2004 ATCS ( Teradyne) Sales agent in Taiwan.
2005 Strategically alliance with Palpilot for multilayer PCB and US market.
Headquartered in Taipei, Taiwan with US$ 14 Million capital.
2005 Sales amount US$26 Million.
2006 Sales amount US$32 Million (Forecast).
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ROHS Innov-X System
RoHS
Pressfit Connector
Subrack
Front Panel Set
Leanpac Company Profile
Product Development
www.leanpac.com
Backplane and System
Packing Manufacture
factory in Taiwan.
www.nextron.com.cn
High volume connector
manufacturing factory in
Guang Dong, China.
www.palpilot.com
Nextron Exclusive
Agency and Alliance
in North America
www.leanpac.com © 2006 Nextronics Engineering Corp. All rights reserved.